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 CMOS Low Power Consumption Input Frequency : 14kHz ~ 35MHz Divider Ratio : 1~ 2047 Divisions (Laser Trimming) Multiplier Ratio : 20 ~ 2047 Multiplications (Laser Trimming) Comparative Frequency : 14kHz ~ 500kHz Output Frequency : 9MHz ~ 80MHz
APPLICATIONS
Crystal oscillation modules Microcontroller PDAs Portable audio systems Various system clocks
GENERAL DESCRIPTION
The XC25BS3 series are high frequency, low power consumption PLL clock generator ICs with built-in crystal oscillator circuit, divider circuit & multiplier PLL circuit. Laser trimming gives the option of being able to select from divider ratios (M) of 1 to 2047 and multiplier ratio (N) of 20 to 2047. Output frequency (Q0) is equal to reference oscillation (fCLKin) multiplied by N/M, within a range of 9MHz to 80MHz. Q1 output is selectable from input reference frequency (f0), Ground (GND), PLL output frequency/2 (Q0/2), and comparative frequency/2 (f0/M/2). Reference oscillation can
FEATURES
Output Frequency Reference Oscillation (fCLKin) Divider Ratio (M) Multiplier Ratio (N) Output : Selectable from divisions of 1 ~ 2047 : Selectable from multiplications of 20 ~ 2047 : 3-State Q1 output selectable from reference oscillation, GND, PLL output frequency/2, comparative frequency/2. Operating Voltage Range: 2.97V ~ 5.5V Low Power Consumption: CMOS (stand-by function included)*1 Ultra Small Package : SOT-26, USP-6B *1 High output impedance during stand-by : 9MHz ~ 80MHz (Q0=fCLKinxN/M) : 14kHz ~ 35MHz
input 14kHz to 35MHz of reference clock. Further, comparative frequency, within a range of 14kHz to 500kHz, can be obtained by dividing the reference oscillation. By halting oscillation via the CE pin, consumption current can be controlled. Output will be one of high impedance.
PIN CONFIGURATION
Q1 VDD CLKin
SOT-26 (TOP VIEW)
PIN ASSIGNMENT
Q0 VSS CE PIN NUMBER SOT-26 USP-6B 1 2 3 3 2 1 6 5 4 PIN NAME CE VSS Q0 Q1 VDD CLKin FUNCTION Chip Enable GND PLL Output Reference Oscillation, GND, Comparative Frequency/2, or PLL Output/2 Output * Power Supply Reference Clock Input
*The dissipation pad for the USP-6B package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VDD pin.
4 5 6
* Q1 Output is selectable from the above mentioned functions.
XC25BS3 ETR1501_003
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XC25BS3 Series
FUNCTION LIST
CE,Q0/Q1 True Logic CE "H" "L" Open FUNCTION Q0/Q1 Clock Output Stand-by Output Pin = High Impedance Stand-by Output Pin = High Impedance (VSS pin pull-down due to IC's internal resistance) "H" = High level "L" = Low level
PRODUCT CLASSIFICATION
Ordering Information
XC25BS3 DESIGNATOR DESCRIPTION Product Number Package SYMBOL Integer M D DESCRIPTION : Based on internal standards e.g. Product number 001 : SOT-26 : USP-6B : Embossed tape, standard feed : Embossed tape, reverse feed = 001
Device Orientation
PACKAGING INFORMATION
SOT-26 USP-6B
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XC25BS3
Series
MARKING RULE
SOT-26
Represents product series MARK B 3 PRODUCT SERIES XC25BS30xxMx
Represents and of product number as in ordering information SOT-26 (TOP VIEW) SYMBOL 1 2 3 4 5 6 7 8 9 A B C D E F H 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 PRODUCT SERIES XC25BS3x01Mx XC25BS3x02Mx XC25BS3x03Mx XC25BS3x04Mx XC25BS3x05Mx XC25BS3x06Mx XC25BS3x07Mx XC25BS3x08Mx XC25BS3x09Mx XC25BS3x10Mx XC25BS3x11Mx XC25BS3x12Mx XC25BS3x13Mx XC25BS3x14Mx XC25BS3x15Mx XC25BS3x16Mx SYMBOL K L M N P R S T U V X Y Z 0 1 1 1 1 2 2 2 2 2 2 2 2 2 2 3 3 7 8 9 0 1 2 3 4 5 6 7 8 9 0* 1* PRODUCT SERIES XC25BS3x17Mx XC25BS3x18Mx XC25BS3x19Mx XC25BS3x20Mx XC25BS3x21Mx XC25BS3x22Mx XC25BS3x23Mx XC25BS3x24Mx XC25BS3x25Mx XC25BS3x26Mx XC25BS3x27Mx XC25BS3x28Mx XC25BS3x29Mx XC25BS3x30Mx XC25BS3X31MX
...
...
...
...
Represents assembly lot number 0 to 9, A to Z, reverse character 0 to 9 and A to Z repeated. (G, I, J, O, Q, W excepted.) * Character inversion is used.
USP-6B
Represents product series MARK S 3 PRODUCT SERIES XC25BS30xxDx XC25BS3SxxDx
1 2 3
6 5 4
B S
3 S
USP-6B (TOP VIEW)
,Represents and of product number as in ordering information (ex) MARK 0 0 7 1 PRODUCT SERIES XC25BS3007Dx XC25BS3S01Dx
Represents production lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excepted) Note: No character inversion used.
3/10
XC25BS3 Series
BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS
PARAMETER Supply Voltage CLKin Pin Voltage CE Pin Voltage Q0 Pin Voltage Q1 Pin Voltage Q0 Output Current Q1 Output Current Power Dissipation SOT-26 USP-6B SYMBOL VDD VCK VCE VQ0 VQ1 IQ0 IQ1 Pd Topr Tstg CONDITIONS VSS-0.3VSS+7.0 VSS-0.3VDD+0.3 VSS-0.3VDD+0.3 VSS-0.3VDD+0.3 VSS-0.3VDD+0.3 50 50 150 100 -30+80 -40+125
Ta = 25 UNITS V V V V V mA mA mW
Storage Temperature Range Operating Temperature Range
4/10
XC25BS3
Series
ELECTRICAL CHARACTERISTICS
XC25BS30xxMR Set Value (example 1)
PARAMETER Input Frequency Q0 Pin Output Multiplier Ratio Output Frequency 1 Output Frequency 2 SYMBOL fCLKin N/M fQ0 Q1 MIN. 13.000 52.000 TYP. 4.000 fCLKin MAX. 20.000 80.000 UNITS MHz Multiplier MHz
DC Characteristics XC25BS30xxMR
PARAMETER Supply Voltage Input Voltage "High" Input Voltage "Low" Input Current "High" Input Current "Low" Output Voltage "High" Output Voltage "Low" Supply Current 1 Supply Current 2 CE "High" Voltage CE "Low" Voltage CE Pull-Down Resistance 1 CE Pull-Down Resistance 2 SYMBOL VDD VIH VIL IIH IIL VOH VOL IDD1 IDD2 VCEH VCEL Rp1 Rp2
fCLKin=20MHz, Q0 pin output multiplier ratio=4, Ta=25, No Load
CONDITIONS
VCK=3.3V VCK=0V VDD=2.97V, IOH=-8mA VDD=2.97V, IOL=8mA CE=3.3V CE=0V
CE=3.3V CE=0.3V
MIN. 2.97 2.7 -3.0 2.5 2.70 0.5 20.0
TYP. 3.30 5.5 1.5 50.0
MAX. 3.63 0.6 3.0 0.4 11.0 5.0 0.45 2.5 80.0
UNITS V V V A A V V mA A V V M k
AC Characteristics
XC25BS30xxMR
PARAMETER Output Rise Time Output Fall Time Duty Ratio Output Start Time PLL Output Jitter SYMBOL TTLH TTHL DUTY Ton Tj
fCLKin=20MHz, Q0 pin output multiplier ratio=4, Ta=25, CL=15pF
CONDITIONS VDD=3.3V (20% to 80%) (*2) VDD=3.3V (20% to 80%) (*2) (*2) 1(*2)
MIN. 40
TYP. 5.0 5.0 50 60
MAX. 60 20
*2
UNITS ns ns % ms ps
R&D guarantee
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XC25BS3 Series
ELECTRICAL CHARACTERISTICS (Continued)
XC25BS30xxMR (Continued) Set Value (example 2)
PARAMETER Input Frequency Q0 Pin Output Multiplier Ratio Output Frequency 1 Output Frequency 2 SYMBOL fCLKin N/M fQ0 Q1 MIN. 10.000 30.000 TYP. 3.000 GND MAX. 16.000 48.000 UNITS MHz Multiplier MHz
DC Characteristics XC25BS30xxMR
PARAMETER Supply Voltage Input Voltage "High" Input Voltage "Low" Input Current "High" Input Current "Low" Output Voltage "High" Output Voltage "Low" Supply Current 1 Supply Current 2 CE "High" Voltage CE "Low" Voltage CE Pull-Down Resistance 1 CE Pull-Down Resistance 2 SYMBOL VDD VIH VIL IIH IIL VOH VOL IDD1 IDD2 VCEH VCEL Rp1 Rp2
fCLKin=16MHz, Q0 pin output multiplier ratio=3, Ta=25, No Load
CONDITIONS
VCK=3.3V VCK=0V VDD=2.97V, IOH=-8mA VDD=2.97V, IOL=8mA CE=3.3V CE=0V
CE=3.3V CE=0.3V
MIN. 2.97 2.7 -3.0 2.5 2.70 0.5 20.0
TYP. 3.30 4.0 1.5 50.0
MAX. 3.63 0.6 3.0 0.4 8.0 5.0 0.45 2.5 80.0
UNITS V V V A A V V mA A V V M k
AC Characteristics XC25BS30xxMR
PARAMETER Output Rise Time Output Fall Time Duty Ratio Output Start Time PLL Output Jitter SYMBOL TTLH TTHL DUTY Ton Tj
fCLKin=16MHz, Q0 pin output multiplier ratio=3, Ta=25, CL=15pF
CONDITIONS VDD=3.3V (20% to 80%) (*2) VDD=3.3V (20% to 80%) (*2) (*2) 1(*2)
MIN. 40
TYP. 5.0 5.0 50 60
MAX. 60 20
*2
UNITS ns ns % ms ps
R&D guarantee
6/10
XC25BS3
Series
TYPICAL APPLICATION CIRCUITS
Circuit Example
Q1 Pin - reference oscillation, PLL output frequency/2, comparative frequency/2
Q1 Pin - GND
NOTES ON USE
(1) Please insert a by-pass capacitor of 0.1F. (2) Rq0 and Rq1 are matching resistors. Their use is recommended in order to counter unwanted radiations. (3) Please place a by-pass capacitor and matching resistors as close to the IC as possible. The output may not be locked if the by-pass capacitor is not close enough to the IC. Further, there is a possibility of unwanted radiation occurrence between the resistor and the IC pin if the matching resistors are not close enough to the IC. (4) When selecting GND for the Q1 pin, although the IC will be connected to GND internally, it is also recommended that the PCB be connected to GND. (5) When the CE pin is not controlled by external signals, it is recommended that a time constant circuit of R1=1kx C1=0.1F be added for stability. (6) With this IC, output is achieved by dividing and multiplying the reference oscillation by means of the PLL circuit. may increase, so all necessary precautions should be taken to avoid this. (7) It is recommended that a low noise power supply, such as a series regulator, be used for the supply voltage. Using a power supply such as a switching regulator might lead to a larger jitter, which in turn may lead to an inability to lock due to the ripple of the switching regulator. (8) As for this IC, synchronization of input and output signal's edge is not guaranteed though the input frequency operates to the output frequency multiply. In cases where this output is further used as a reference oscillation of another PLL circuit, the final output signal's jitter
7/10
XC25BS3 Series
REFERENCE LAND PATTERN
Q1 Pin - reference oscillation, PLL output frequency/2, comparative frequency/2
Q1 Pin - GND
8/10
XC25BS3
Series
AC CHARACTERISTICS WAVEFORMS
1) Output Rise Time / Output Fall Time
2) Duty Ratio
3) Output Start Time
9/10
XC25BS3 Series
1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this catalog is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this catalog. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this catalog. 4. The products in this catalog are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this catalog within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this catalog may be copied or reproduced without the prior permission of Torex Semiconductor Ltd.
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